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July 2009

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Subject:
Re: Via on pad issues
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Wed, 22 Jul 2009 09:37:15 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (59 lines) 
IMHO this would never meet the acceptability requirements for use in
Aerospace product.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brubacher, John
(BI09)
Sent: Wednesday, July 15, 2009 2:13 PM
To: [log in to unmask]
Subject: [TN] Via on pad issues

Hello all,

 

Does anybody have experience with using a through hole via at the edge
of the pad on a 0201 component? Can this be assembled reliably or are
there significant issues to overcome?

 

Regards,

John Brubacher, CID

Honeywell Security & 

Data Collection (Video)

 


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