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July 2009

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 21 Jul 2009 13:05:53 -0400
Content-Type:
text/plain
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text/plain (160 lines)
Thank you, Victor
 
I am gathering that this is not a standard IC device based on your
description but a DIP which has the leads shaped in a gull wing format as opposed
to straight leads as is the norm.
 
I was under the impression you were using a standard package of which there
 are several package types which might be covered by your description
including: the SOP, the SSOP, the TSOP and the TSSOP both of later can be
either TYPE 1 or TYPE 2. (leads on short side vs lead on long side) Lead pitch
will also be important and depending on the device lead pitch can be 0.50mm,
0.55mm, 0.60mm, 0.65mm, 0.80mm, 1.0mm and 1.27mm
 
From this list you might be able to identify one which most closely
represents your special device and work from there.
 
Good luck with your project,
Joe
 
   
 
 
In a message dated 7/21/2009 9:14:17 A.M. Pacific Daylight Time,
[log in to unmask] writes:

A surface mount dual in line plastic package with leads formed in a gull
wing fashion.



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Tuesday, July 21, 2009 10:49 AM
To: [log in to unmask]
Subject: Re: [TN] Dual In Line Package, 8 pin, lead width versus
external copper pad ...

Hello Victor

There is perhaps a bit of confusion in terms here. Dual In-line
Packages
(DIP) are generally through hole leaded devices. The term "gull wing"
indicates a surface mount device which is what seems to be of interest
to you. I
would add to Steve's comments that the component suppliers often
provide
their recommendations as well.

Kind regards,
Joe


In a message dated 7/21/2009 5:28:04 A.M. Pacific Daylight Time,
[log in to unmask] writes:

I did not receive any input on my initial inquiry. I will resubmit
it
now.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Monday, July 20, 2009 10:57 AM
To: [log in to unmask]
Subject: [TN] Dual In Line Package, 8 pin, lead width versus external
copper pad width

Fellow TechNetters:

What is IPC guidelines for a DIP gull wing component lead width ratio
to external copper pad width on lead free
assemblies?

Victor,

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