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July 2009

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Subject:
From:
Ray Kong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ray Kong <[log in to unmask]>
Date:
Sun, 19 Jul 2009 11:13:17 -0700
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text/plain
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text/plain (35 lines)
Hi all,

Per JEDEC STD MO-269 and MO-224, note 12,

Recommended plating for contact pads are:

1) Preferable plating : Electrolytic Gold plating 0.76
micrometers minimum over electrolytic nickel 2.00 micrometers minimum.

2) Alternative plating: Gold plating 0.05-0.75 micrometers over
nickel 2.00 micrometers minimum must use an electronic contact grade
corrosive barrier lubricant.

I have a few questions:
1) "is the alternative Au plating electroless?" Gold flash?
2) What is "an electronic contact grade corrosive barrier lubricant?"
Can some provide a specific mateial?
3) Who will be applying this "electronic contact grade corrosive
barrier lubricant" onto the bare board? The fab supplier?
4) What percentage of fabs are build with alternative plating today?

Thanks all in advance.

Ted

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