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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Fri, 17 Jul 2009 14:31:10 -0700
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HIP - HOP it's all the same to me......8-)

John Burke
(408) 515 4992


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Friday, July 17, 2009 9:19 AM
To: [log in to unmask]
Subject: Re: [TN] [SMART] Head In Pillow Joints->Head On Pillow

 'Head In Pillow' sure is a strange terminology--'Head On Pilow' is by far
more descriptive
Werner


 


 

-----Original Message-----
From: Mike Fenner <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Jul 17, 2009 5:03 am
Subject: Re: [TN] [SMART] Head In Pillow Joints










Since 2001? Ingenious as ever John, but perhaps it maybe time to look at
more modern materials which address this issue without mechanical aids.

 

Regards

 

 

Mike

  _____  

From: SMART Group smart-e-link [mailto:[log in to unmask]] On
Behalf Of John Burke
Sent: 16 July 2009 18:51
To: [log in to unmask]
Subject: Re: [SMART] Head In Pillow Joints

 

Quite often seen as a field failure since due to the compression of the head
in pillow interface it is quite possible to test and get signals through
only to find it fails in the field.

 

Data for this defect would be best found from companies using large BGA's
say above 20 x 20 mm with smaller BGA pitch - say 0.8mm and below, and
taking both their internal records of such failures and mapping it with RMA
returns for the same defect. Truth is, this defect actually in many cases
results in an RMA return where upon return there is NTF (No trouble found).

 

If you really want to find if you have this condition in your manufacturing
process the only way to completely engineer it out is to include a vibration
under power and use test during the pilot runs to tune in the reflo
w
profile.

 

I have used this method since 2001.

 

John

 

John Burke

(408) 515 4992

 

  _____  

From: SMART Group smart-e-link [mailto:[log in to unmask]] On
Behalf Of bob Willis
Sent: Thursday, July 16, 2009 9:25 AM
To: [log in to unmask]
Subject: Re: [SMART] Head In Pillow Joints

 

  _____  


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  _____  

 <http://www.smartgroup.org> SMART logo  smart-e-link is an e-mail technical
forum organised by the SMART Group. Visit our webpage
<http://www.smartgroup.org/smtlink.htm>  for subscription information, rules
of use and any questions.

smart-e-link is sponsored by Soldertec Global <http://www.soldertec.com>  -
a business 
providing laboratory testing, troubleshooting, and analytical
services to the global electronics industry. Services include x-ray
inspection, scanning electron microscopy, solderability testing, SIR and in
testing of components and materials for compliance with the RoHS Directive.
Visit www.soldertec.com. 

To unsubscribe to smart-e-link, send an e-mail to
[log in to unmask] with the following text in the body (not the
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