TECHNET Archives

July 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Kenneth Wood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kenneth Wood <[log in to unmask]>
Date:
Wed, 15 Jul 2009 22:48:13 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (69 lines)
John,
According to the IPC, the pads for an 0201 should be 16.5mils x 18mils
(0.42mm x 0.46mm). 
This is a tad bit small to put a 10mil hole into but you could increase the
size of the pad to 20mils square and put the hole in the center of it.
You will however need to epoxy fill the hole to guard against solder
wicking. Contact your board house for the material they use for this.
Regards
Ken

_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.            
www.saturnpcb.com
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brubacher, John (BI09)
Sent: Wednesday, July 15, 2009 5:13 PM
To: [log in to unmask]
Subject: [TN] Via on pad issues

Hello all,

 

Does anybody have experience with using a through hole via at the edge
of the pad on a 0201 component? Can this be assembled reliably or are
there significant issues to overcome?

 

Regards,

John Brubacher, CID

Honeywell Security & 

Data Collection (Video)

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2