All the formulations that I tested electromigrate at 85/85 -50V on IPC B 24
coupons (0.5mm spacing) and at 65/85 10V on IPC B 25 B combs (12.5 mil
spaces), so that's too close.
Please respond to
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; Please respond
to
John Burke
<jburke@OPTICHRON
.COM>
Many years back (too many) I was working on silver epoxy connected hybrids
for high reliability applications.
I seem to recall that silver migration is a definite issue. Does anyone
have
any rules for mitigating this risk such as design clearances between pads
etc?
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