TECHNET Archives

July 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
stephengregory5849 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, stephengregory5849 <[log in to unmask]>
Date:
Tue, 14 Jul 2009 23:17:19 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (193 lines)
Hi Pradeep,

If you don't see any problem with the boards, maybe it could be the parts? 
Are all the PTH parts getting blowholes, or is it just some? I don't know if 
you remember the problem I had a few weeks ago (when I was actually 
working), with the plating finish on the leads of a SMT connector.

Granted, in my case it was a SMT connector, but as Dave Hillman pointed out, 
if the parts have a bright acid tin plating (trying to be RoHS compliant), I 
can see that causing blowholes and pin holes. My connectors were from AMP by 
the way....

Here's a pic to refresh your memory of what my connectors looked e after 
reflow:

http://stevezeva.homestead.com/files/Connector_Blumpies.jpg

The part of the leads that aren't actually in the barrels would probably 
look fine, but the part of the leads that are actually in the solder joints 
would be outgassing like crazy....

Steve

----- Original Message ----- 
From: "mp3" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 14, 2009 10:50 PM
Subject: Re: [TN] Solderability


> Dear Mr.Werner,
>
> They claim, they did bake it at 120degC for 2 hours before they were wave 
> soldered. Will moisture affect solderability ? Can you kindly brief how. 
> We were under the impression that it affects only the PTH reliability.
>
> regards
>
> pradeep
>
> Werner Engelmaier /* wrote at Wed Jul 15 01:25:30 GMT+05:30 2009:
>> Hi Pradeep,
>>Did they bake the moisture out of the PCBs prior to wave soldering?
>>Werner
>>
>>
>>
>>
>>
>>
>>
>>-----Original Message-----
>>From: mp3 <[log in to unmask]>
>>To: [log in to unmask]
>>Sent: Tue, Jul 14, 2009 6:50 am
>>Subject: [TN] Solderability
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>Hi,
>>
>>We are a PCB manufacturer and we had supplied some 2.4mm thick PCBs to one 
>>of
>>our customers who has complained regarding solderability issue. They say 
>>there
>>are having issues with respect to blowholes / pinholes after 
>>wavesoldering. We
>>had checked for solderability on the coupon and had ensured that 
>>everything is
>>acceptable prior to the despatch. We repeated the same after receipt of 
>>the
>>feedback and found the results to be OK. To simulate it, we sent a couple 
>>of
>>bare circuits to a 3rd party assembler and got it wave soldered. The hole
>>diameters are 2.55mm and 1.0mm . The photographs after wavesoldering 
>>trials are
>>attached. We find it to be quite OK. We feel that since there are no 
>>components,
>>and since the diameter is on the higher side, there will be a slight 
>>depression
>>at the centre. But the customer insists that the trial boards too have a
>>problem. Can you give a feedback on this after checking the attached
>>photographs. We were asking our customer to check on the parameters like 
>>fluxing
>>etc. And he says all are well in control. Any inputs to understand this 
>>issue
>>better.
>>
>>rgds
>>
>>pradeep
>>
>>
>>---------------------------------------------------
>>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>>To unsubscribe, send a message to [log in to unmask] with following text in
>>the BODY (NOT the subject field): SIGNOFF Technet
>>To temporarily halt or (re-start) delivery of Technet send e-mail to
>>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>>To receive ONE mailing per day of all the posts: send e-mail to
>>[log in to unmask]: SET Technet Digest
>>Search the archives of previous posts at: http://listserv.ipc.org/archives
>>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
>>for
>>additional information, or contact Keach Sasamori at [log in to unmask] or
>>847-615-7100 ext.2815
>>-----------------------------------------------------
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>-------------------------------
>>Micropack Ltd, Bangalore, India
>>
>>
>>---------------------------------------------------
>>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>>To unsubscribe, send a message to [log in to unmask] with following text in
>>the BODY (NOT the subject field): SIGNOFF Technet
>>To temporarily halt or (re-start) delivery of Technet send e-mail to
>>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>>To receive ONE mailing per day of all the posts: send e-mail to
>>[log in to unmask]: SET Technet Digest
>>Search the archives of previous posts at: http://listserv.ipc.org/archives
>>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
>>for
>>additional information, or contact Keach Sasamori at [log in to unmask] or
>>847-615-7100 ext.2815
>>-----------------------------------------------------
>>
>>
>>
>>
>>
>>
>>---------------------------------------------------
>>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>>To unsubscribe, send a message to [log in to unmask] with following text in
>>the BODY (NOT the subject field): SIGNOFF Technet
>>To temporarily halt or (re-start) delivery of Technet send e-mail to 
>>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>>To receive ONE mailing per day of all the posts: send e-mail to 
>>[log in to unmask]: SET Technet Digest
>>Search the archives of previous posts at: http://listserv.ipc.org/archives
>>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
>>for additional information, or contact Keach Sasamori at [log in to unmask] or 
>>847-615-7100 ext.2815
>>-----------------------------------------------------
>>
>>
>>
>
> -------------------------------
> Micropack Ltd, Bangalore, India
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to 
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to 
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
> for additional information, or contact Keach Sasamori at [log in to unmask] or 
> 847-615-7100 ext.2815
> ----------------------------------------------------- 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2