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July 2009

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 10 Jul 2009 10:21:03 -0500
Content-Type:
text/plain
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text/plain (29 lines)
Fellow TechNetters:

   I have posed this inquiry before with little response. Therefore, I
will try again. Is there Industry Standards/Guidelines/bench
mark/criterion for the red glue process. IMHO, The glue has to provide
an adequate bonding strength to the BGA for the added value of the
process. Just applying the glue does not guaranty additional strength
to the BGA. I have pulled many BGAs and see a wide variation of
adhesion properties from one vendor to another. Does the glue have to
induced damage to the silk screen, solder mask and/or external copper
lands to deem it a good adhesion property? I am searching for some
form on consensus from the forum.

Victor,





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