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July 2009

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Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Fri, 10 Jul 2009 09:21:09 -0400
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Dear Technetters,
We have an instance of solder splash after wave on a AMP socket (1-822473-5) and the PCB underneath the socket. There are very fine particles of solder (or surface finish, I am going to do a SEM to find out the composition) that are evident visually during inspection after wave. The surface finish on the board is HASL and on the socket is Sn (Base metal is phosphor bronze).

I tried a few sockets by fluxing them and manually holding them over the solder pot. I observed that the solder actually sticks to the plastic portion of the socket if it comes in contact with the socket body. Is that normal?

I will adjust the wave ht to prevent the solder from drawing up the lead so much that it comes in contact with the body as see if this issue goes away

In the mean time, I thought about posting this on Technet to see if anybody else has observed a similar phenomenon before.

Any leads will be greatly appreciated.

Regards,
Amol



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