Gobi,

If the device is more like a small outline no-lead IC then:

SON65P330X330X112-8N

If the device is more like a small outline transistor flat lead then:

SOTFL65P330X112-8N

 I am basing this off the footprint spec sheet and the PCB Matrix IPC
land calculator since I do not have an actual image of the device or a
part in hand to refer to. I believe it is the SOFTL device you are
looking for but you will need to verify to be sure.

Regards,
 
Jeffrey A. Traw  |  Electronic Engineer  |  Polyvision  |  o:
503-523-2018  |  c: 503-781-8311  |  f: 503-523-2020  |  polyvision.com
 
Meet eno. One whiteboard... infinite possibilities
http://www.youtube.com/watch?v=SSLKGQEeags&fmt=18

 
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Gobinathan Athimolom
Sent: Wednesday, July 01, 2009 8:39 PM
To: [log in to unmask]
Subject: [DC] Land Pattern Naming convention for PowerPAK 1212-8 package

Hello ALL,

I'm not sure the criteria to follow for naming convention for VISHAY - 
PowerPAK 1212-8 single package. I couldn't find on the IPC document that

has naming convention for non-standard SMT land pattern that can be used

for this PowerPAK 1212-8 package. Appreciate any input/suggestion for 
naming convention.

Thanks.

Gobi

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