It would either a mainly tin electroplating solution mixed with a
silver solution that was electroplated onto copper, or three separate
solutions that are electroplated onto the wafer one at a time.  The
copper would most likely not be electroplated, but sputtered or
electroless plated.

> Kody, do you mean using a fused Sn97.3Ag.05 alloy, similar to the
> commonly used fused SnPb (FTL) surface finish? After reflow, it would be
> the same as SAC305.
> I do not know if this has been done or not.
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
> Sent: Thursday, July 30, 2009 2:40 PM
> To: [log in to unmask]
> Subject: Re: [LF] Plating SAC305
>
> Hi Kody,
>
> What SnAg "solution" you are talking about. No such solution exists.
>
> Vladimir
> SENTEC
> ------Original Message------
> From: Kody
> Sender: Leadfree
> To: [log in to unmask]
> ReplyTo: (Leadfree Electronics Assembly Forum)
> ReplyTo: Kody
> Sent: Jul 30, 2009 15:08
> Subject: [LF] Plating SAC305
>
> Has there been any success in plating SAC305 by either plating copper
> then tin then silver or using a SnAg solution on copper?  More
> specifically
> for wafer bump plating.  Any information would be helpful.
>
>                                         Thanks, Kody
>
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