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July 2009

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
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Date:
Thu, 30 Jul 2009 19:40:18 +0000
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Hi Kody,



What SnAg "solution" you are talking about. No such solution exists.



Vladimir

SENTEC

------Original Message------

From: Kody

Sender: Leadfree

To: [log in to unmask]

ReplyTo: (Leadfree Electronics Assembly Forum)

ReplyTo: Kody

Sent: Jul 30, 2009 15:08

Subject: [LF] Plating SAC305



Has there been any success in plating SAC305 by either plating copper

then tin then silver or using a SnAg solution on copper?  More specifically

for wafer bump plating.  Any information would be helpful.



                                        Thanks, Kody



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