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July 2009

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Subject:
Re: Plating SAC305
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 30 Jul 2009 19:40:18 +0000
Content-Type:
text/plain
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text/plain (1 lines) 
Hi Kody,



What SnAg "solution" you are talking about. No such solution exists.



Vladimir

SENTEC

------Original Message------

From: Kody

Sender: Leadfree

To: [log in to unmask]

ReplyTo: (Leadfree Electronics Assembly Forum)

ReplyTo: Kody

Sent: Jul 30, 2009 15:08

Subject: [LF] Plating SAC305



Has there been any success in plating SAC305 by either plating copper

then tin then silver or using a SnAg solution on copper?  More specifically

for wafer bump plating.  Any information would be helpful.



                                        Thanks, Kody



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