Hi Kody,
What SnAg "solution" you are talking about. No such solution exists.
Vladimir
SENTEC
------Original Message------
From: Kody
Sender: Leadfree
To: [log in to unmask]
ReplyTo: (Leadfree Electronics Assembly Forum)
ReplyTo: Kody
Sent: Jul 30, 2009 15:08
Subject: [LF] Plating SAC305
Has there been any success in plating SAC305 by either plating copper
then tin then silver or using a SnAg solution on copper? More specifically
for wafer bump plating. Any information would be helpful.
Thanks, Kody
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