Hello Jack,
With SMOBC, I've had no problems with using solid copper for large
consuctive areas.
Certainly, it was a problem in the days with all over solder finish
under the solder mask.
I don't believe that there is any problem with the pattern plating of
the board either.
Modern LPI soldermasks adhere to the bare copper quite well also.
 

regards,
Phil. 




________________________________

From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jack
Olson
Sent: Thursday, 30 July 2009 8:48 AM
To: [log in to unmask]
Subject: [DC] Hashing-Out Hatching


Greetings, 
 
I was just reading through the latest draft of IPC-2222,
and stumbled into the advice in section 10 regarding
"large conductive areas", where we are advised to 
use some kind of etched pattern (cross-hatching)
for any area larger than a 25mm diameter circle.
 
I have done this exactly once in the last 22 years, 
does anyone else do this?
 
Has anyone ever experienced a problem by NOT doing
this? (not counting soldermask over HASL)   
 
Jack
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