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| Date: | Tue, 21 Jul 2009 10:07:30 -0400 |
| Content-Type: | text/plain |
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Victor,
Only you or your EE's can determine the required minimum electrical spacing and isolation needed for your product. However, from an assembly standpoint, lifted mask between two pads is an IPC-610 defect (Ref Rev D section 10.5.1.2) for all 3 classes, and furthermore is a real risk for wash media or other contaminants (service environment?) getting trapped and creating a nice conductive stew. Worst case is the board stops working.
Kevin Glidden
-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: Tuesday, July 21, 2009 9:35 AM
To: [log in to unmask]
Subject: [TN] Solder mask undercut/over exposed
Fellow TechNetters:
What are worst case scenario when solder mask is undercut/over
exposed to the point that it is floating and not touching the laminate
between two adjacent lead on a DIP gull wing device.
Victor,
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