Dear all, By cross sectioning BGA solder joints on a failed assembly, I found that the suspected joints are not uniform and that they contain unusual separation areas. I suspect mixed assembly and/or bad reflow profile. Steve was so kind and enabled me to send the links. Please may I have your opinion? http://stevezeva.homestead.com/files/small.jpg <http://stevezeva.homestead.com/files/small1.jpg> http://stevezeva.homestead.com/files/small1.jpg <http://stevezeva.homestead.com/files/small2.jpg> http://stevezeva.homestead.com/files/small2.jpg http://stevezeva.homestead.com/files/small3.jpg <http://stevezeva.homestead.com/files/small4.jpg> http://stevezeva.homestead.com/files/small4.jpg Gaby --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------