Embedment is the consummate conclusion of two potted individuals in an
encapsulating environment.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Thursday, June 04, 2009 12:10 PM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting
Doug,
My shot at this...
1. What would you consider to be a definition of "potting" and a
definition of "encapsulation"?
According to Webster's, a device is encapsulated when it is "surrounded
by a gelatinous or membranous envelop." Based on this definition, I
would consider potting and encapsulation to be the same.
2. Are there standard definitions for these somewhere? They don't
exist in IPC as far as I know.
I'm not aware of any. You're entering new territory kid.
3. What would you consider to be the boundary between conformal coating
and "potting or encapsulation"? I have my own opinions but want to hear
yours.
Conformal coat is a 3 - 5 mil finish on a circuit card. The device is
not fully submerged.
Potting or Encapsulation fully submerges the device in a material.
4. In what class would you consider an underfill to be in?
I would consider it a separate class from encapsulated materials and
conformal coating.
Hope this helps. Good Luck
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
Sent: Thursday, June 04, 2009 2:32 PM
To: [log in to unmask]
Subject: [TN] Coating, Encapsulation, and Potting
Good afternoon all,
All this talk of underfill sparked a reminder of an IPC action item of
mine. Unknownst to most of you , I signed you all up on some of my
committees. There will be a new task group addressing potting and
encapsulation, which will meet at the Fall IPC. We already have
conformal
coat task groups.
So, I wish to initiate a series of questions and illuminating debate.
Pardon me if I fall short on the illumination part (leave it alone
Dewey).
1. What would you consider to be a definition of "potting" and a
definition of "encapsulation"?
2. Are there standard definitions for these somewhere? They don't
exist
in IPC as far as I know.
3. What would you consider to be the boundary between conformal coating
and "potting or encapsulation"? I have my own opinions but want to hear
yours.
4. In what class would you consider an underfill to be in?
That's enough homework for now.
Doug Pauls
Rockwell Collins
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