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June 2009

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Thu, 4 Jun 2009 13:38:16 -0700
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In answer to question 4 I would put it in the category of underpotting......

John Burke
(408) 515 4992


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
Sent: Thursday, June 04, 2009 11:32 AM
To: [log in to unmask]
Subject: [TN] Coating, Encapsulation, and Potting

Good afternoon all,

All this talk of underfill sparked a reminder of an IPC action item of 
mine.  Unknownst to most of you , I signed you all up on some of my 
committees.  There will be a new task group addressing potting and 
encapsulation, which will meet at the Fall IPC.  We already have conformal 
coat task groups. 

So, I wish to initiate a series of questions and illuminating debate. 
Pardon me if I fall short on the illumination part (leave it alone Dewey).

1.  What would you consider to be a definition of "potting" and a 
definition of "encapsulation"? 

2.  Are there standard definitions for these somewhere?  They don't exist 
in IPC as far as I know.

3.  What would you consider to be the boundary between conformal coating 
and "potting or encapsulation"?  I have my own opinions but want to hear 
yours.

4.  In what class would you consider an underfill to be in?

That's enough homework for now. 

Doug Pauls
Rockwell Collins

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