1 Potting implies that the "device" is placed in a container, and that the
container is filled with a
sealant material, thus encapsulating the device. Encapsulation implies
that the "device" is almost
completely sealed with a material, though a container is not necessary as
in the case of potting.
Potting is a subset of encapsulaltion.
2. Don't know.
3. Coating implies a film of sealant material,, no more than 1 or 2? mm
thick, probably less .
A -completely- coated device may be encapsulated, but not all coated
circuits are completely coated.
4. Don't know, but I'd guess encapsulant, as the sealant is not applied as
a film as with coatings..
Karen Tellefsen - Electrical Testing
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Douglas Pauls <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
So, I wish to initiate a series of questions and illuminating debate.
Pardon me if I fall short on the illumination part (leave it alone Dewey).
1. What would you consider to be a definition of "potting" and a
definition of "encapsulation"?
2. Are there standard definitions for these somewhere? They don't exist
in IPC as far as I know.
3. What would you consider to be the boundary between conformal coating
and "potting or encapsulation"? I have my own opinions but want to hear
yours.
4. In what class would you consider an underfill to be in?
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