Randy,
We are talking about non-conductive and hopefully (!) non-corrosive
organic underfills.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Randall L Bock
Sent: Thursday, June 04, 2009 11:33 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
By material is this solder or someother substance?? Solder could pose a
short issue if it came loose. Other material could also pose the same
concern.
Randy Bock Sr.
Quality Engineer / Product Quality Manager
Enterprise Quality Assurance
(Email) [log in to unmask]
Newtown Building 2
203 270-4931 (NT2)
8-426-4931
(Fax)203-270-4982
Shelton 27 WV 203-922-4014
(Cell) 203 300-3547
Pitney Bowes "Engineering the Flow of Communication"
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Thursday, June 04, 2009 11:30 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Graham,
No clue. This is what my Class 3 buddy wanted to see in the proposed
doc. Anyone want to explain why or refute its inclusion with data?
Bev
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, June 04, 2009 11:27 AM
To: TechNet E-Mail Forum; Bev Christian
Subject: RE: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Hi Bev
Why would material on the component top be considered a defect? Process
indicator I can see, but does it impact reliability?
regards,
- Graham
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Thursday, June 04, 2009 12:07 PM
To: [log in to unmask]
Subject: [TN] Underfill Workmanship Pass/fail Criteria Proposal
TechNetters,
OK after speaking to a couple of industry friends, this is what we have
come up with. I will leave it to them to speak up and identify
themselves, if they wish. I have written this up in IPC-A-610 format
and have tried to cover all situations for Class 2 and 3 products in
particular.
If we can nail this, I would like to present this to the IPC as the
first IPC draft doc essentially hammered out by out TechNet community.
Comments readily accepted!
Bev
RIM
Workmanship Standards for BGA and CSP Underfills
Target - Class 1,2,3
* Component requiring underfill completely underfilled with a good
fillet all the way around, the fillet just approaching the maximum
component body height, completely cured, no encroachment onto other
components and no voiding whatsoever
Acceptable - Class 3
* At least 50% fillet height up the side of the component body
* Small pin holes and voids are permissible provided they do not
exceed 5% of fillet surface area and have a maximum diameter of 0.5 mm
(0.020 inches).
Acceptable - Class 1,2
* Component requiring underfill underfilled such that all balls
are covered, but no evidence of an exterior fillet, no encroachment onto
other components and no voiding whatsoever
* Component requiring underfill underfilled such that all balls
are covered, with or without an exterior fillet, no encroachment onto
other components and only small voids, not touching any solder joints
* Component requiring underfill underfilled such that all balls
are covered, with or without an exterior fillet, no encroachment onto
other components and even large voiding, but not touching any solder
joints
* A void or voids less than or equal to 50% around the perimeter
of one or more solder joints
Defect - Class 1,2,3
* Underfill completely missing from components where it is
required
* Underfill not completely covering all the peripheral solder
joints
* Voiding such that a void traverses the distance between two or
more solder joints under the array device requiring underfill
* A void or voids more than 50% around the perimeter of one or
more solder joints
* Material extending on to the top of the BGA or CSP
* Uncured material
Special Conditions - Class 1,2
* Encroachment onto other components, but meeting all other
criteria above for target or acceptable conditions will be dealt with as
a pass/fail on a case-by-case basis
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