TECHNET Archives

June 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Wed, 3 Jun 2009 18:02:10 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (212 lines)
Oh you are tooo much.  Why an I still at work at 6 PM?
Bev

-----Original Message-----
From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]] 
Sent: Wednesday, June 03, 2009 6:01 PM
To: Bev Christian; TechNet E-Mail Forum
Subject: RE: NTC RE: [TN] PTH - 6X thermal stress

Bev,
Thanks, but in this case I would like to believe your LOL was in reference to logic over laughter, as you saw the merit of the matrix as it relates to the life of the product rather than the product of my life in a matrix.
Dewey

-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]] 
Sent: Wednesday, June 03, 2009 2:19 PM
To: TechNet E-Mail Forum; Whittaker, Dewey (EHCOE)
Subject: NTC RE: [TN] PTH - 6X thermal stress

Lol

Ah, Dewey.  You have too much time on your hands.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Wednesday, June 03, 2009 5:10 PM
To: [log in to unmask]
Subject: Re: [TN] PTH - 6X thermal stress

A - Commodity build fabricator

B - High-rel fabricator

C - Dicy-cured FR4 170¨¬ C Tg (IPC-4101/24, /26)

D - Phenolic-cured FR4 (IPC-4101/126, /129)

E - Eutectic 230¨¬C thermal excursion

LF - Lead-free 260¨¬C thermal excursion

1 through 6 - number of thermal excursions

P - Pass test without delamination or separation

F - Failed test by demonstration of delamination and/or separation

 

A + C + E + 1 = P

A + C + E + 2 ¡Â P = ¡Ã F

A + C + E + 3 = F

A + D + E + 1 = P

A + D + E + 2 = P

A + D + E + 3 = P

A + D + E + 4 ¡Â P = ¡Ã F

A + C + LF + 1 ¡Â P = ¡Ã F

A + C + LF + 2 = F

B + C + E + 1 = P

B + C + E + 2 = P

B + C + E + 3 ¡Â P = ¡Ã F

B + C + E + 4 = F

B + D + E + 1 = P

B + D + E + 2 = P

B + D + E + 3 = P

B + D + E + 4 = P

B + D + E + 5 = P

B + D + E + 6 = P

A + D + LF + 1 = P

A + D + LF + 2 = P

A + D + LF + 3 ¡Â P = ¡Ã F

B + D + LF + 1 = P

B + D + LF + 2 = P 

B + D + LF + 3 = P

B + D + LF + 4 = P

B + D + LF + 5 = P

B + D + LF + 6 = P

B + C + LF + 1 = P 

B + C + LF + 2 ¡Â P + ¡Ã F

B + C + LF + 3 = F

 

Assuming all other things being equivalent, you can use the above to assess the merit of expectant results. The wisdom of free advice and knowing the source of that same said advice being what it may (or June in this case), you can always buy Werner¡¯s White Paper.

 

Dewey

 

 

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of mp3
Sent: Tuesday, June 02, 2009 10:53 PM
To: [log in to unmask]
Subject: [TN] PTH - 6X thermal stress

 

Dear all,

 

Our routine tests for one of our customers include 6X thermal stress on every panel before despatch. Currently we are evaluating a new elctroless chemistry. We would like to have some suggestions from the technetters on which of the electroless chemistries are best suited for meeting the 6X thermal stress tests - Low build / medium build / high build. We do a copper strike after electroless plating and before pattern printing. We also do a plasma desmear followed by a chemical desmear which will achieve an etchback of 5-8 microns. Kindly share any suggestions which you feel will further improve the PTH relaibility. We use 175 Tg laminate and prepreg of Nelco (N4000-6) and achieve a pretty good hole wall during drilling. 

 

In the past we have had a few instances of innerlayer separation during 3x and 6x thermal cycles. Almost all the panels pass 1x thermal stress.

 

looking forward for the valuable inputs

 

Rgds

 

Pradeep Menon

 

 

-------------------------------

Micropack Ltd, Bangalore, India

 

---------------------------------------------------

Technet Mail List provided as a service by IPC using LISTSERV 15.0

To unsubscribe, send a message to [log in to unmask] with following text in

the BODY (NOT the subject field): SIGNOFF Technet

To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)

To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest

Search the archives of previous posts at: http://listserv.ipc.org/archives

Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815

-----------------------------------------------------


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2