TECHNET Archives

June 2009

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
When not to underfill
From:
Edward Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Edward Rios <[log in to unmask]>
Date:
Wed, 3 Jun 2009 16:45:06 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Hi TechNet,

OK I'll admit it, I'm fairly new to the field of solder joint 
reliability. ;)  Therefore, the recent thread about underfill inspection 
criteria prompted me to do additional reading on the subject. It seems 
like there is consensus on the positive effect of underfilling on BGA 
solder joint reliability. On the other hand, are there cases where 
underfill doesn't have a significant impact? Maybe in smaller BGA 
components?

Thanks,

Ed Rios

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2