Hi Everyone,
I am looking for any published studies comparing the merits of
adhesiveless vs. adhesive based flexible circuit laminates. Most of our
flex designs are based upon a Polyamide based double sided flex with
components on one side that are supported by a stiffener (FR4) on the
back side, under the components. We are getting into more and more
designs that will have components on both sides and be folded into a
small enclosure. I am concerned that if we stay with the current
adhesive based stackups we will be running into via failures due to
mismatched CTE's.
Any information out there that anybody knows of would be greatly
appreciated.
Thanks in advance,
Dave Connitt CID+
Printed Circuit Designer
L3 Fuzing & Ordnance Systems
A Wholly Owned Subsidiary of:
L3 Communications
3975 McMann Road
Cincinnati, Ohio 45245
Ph. 513- 943-2010   Fax 513-943-2288

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