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June 2009

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Thu, 25 Jun 2009 14:11:18 +0100
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Hi Techies

As a follow-up to Richard's question, you might note that I have  
presented a "Solder Paste Process Test" that is a modified version of  
the 5 IPC-TM-650 methods examining: Slump, Solder Balling, Spreading,  
Tack and Wetting plus a new "Open Time" method. These can all be run  
within an hour to verify the paste is fit for use.

The original document is a SMART Standard that is now in with IPC  
Committee for consideration.

If anyone wants some more information, let me know directly.

Regards

Graham Naisbitt

Email: [log in to unmask]
Phone: +44 (0)12 5252 1500
Web: www.gen3systems.com

On 24 Jun 2009, at 15:22, Stadem, Richard D. wrote:

> I would like to know what others do to ensure that the solder paste is
> good at the point of use.
>
> I am NOT looking for a solder paste handling procedure, what I am
> looking for is what type of test can be performed that is quick, easy,
> and does not hold up production. We do paste viscosity testing on each
> lot that we receive, and we also strictly monitor our paste printing
> process with the post-print inspection machine. We have validated our
> entire solder paste handling system to ensure that the paste is  
> handled,
> labeled, and properly rotated.
>
> We have had no issues with the solder paste that we use.
>
> Our customer thinks we should test each lot of paste when it is  
> removed
> from refrigeration prior to use on production hardware.  I am not  
> really
> sure what a second viscosity check would do for us, but I am open to
> some other testing method that does not consume a lot of paste and  
> would
> provide data we can use.
>
> Any suggestions?
>
>
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