As Mike said, if you're going to test, you want something meaningful. Although I have no personal experience with either of these methods, I know that the intent of both was to provide such data.
EMPF PP0016 - Using AC Impedance Measurements to Control Quality and Printability of Solder Pastes (Mar 1996)
Gen3 offers: http://www.gen3systems.com/viewprod-SPA1000.php
Chris Mahanna
Robisan Laboratory
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Wednesday, June 24, 2009 12:01 PM
To: [log in to unmask]
Subject: Re: [TN] Solder paste validation at point of use
Your customer is a little behind the times, [but then he is the customer.] People used to do this to try to find good product in the stuff they received and/or find the number that corresponded to the good stuff.
As you know few paste problems are to do with as received viscosity, and a half decent operator using a MK1 Eyeball and $2.00 spatula will spot them anyway.
These days most people's objective is to have products that are ship to line, including paste, and that is possible. In Europe we have a small handful of people who check our viscosity, and that's a generous assessment.
I imagine the same in RoW.
Viscosity checks usually cause grief because few users are prepared to pay for a decent viscometer or trained staff, so the as-received measurement is apparently different to the as-shipped.
Question: why would we, or anyone else for that matter, measure something find it wrong, and then ship it anyway. Especially to someone we know is going to check it? Sorry I am ranting a bit...
If you need to do a test I suggest a simple print and reflow test, using a spare area [on the unseparated panel] of your production boards. This can be printed up with a line of varied pitch dots. You can check print quality, coalescence and spread, the test also verifies solderability of board. Bob Willis has a chart or something on this which explains it all.
Regards
Mike Fenner
Indium Corporation
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, June 24, 2009 3:22 PM
To: [log in to unmask]
Subject: [TN] Solder paste validation at point of use
I would like to know what others do to ensure that the solder paste is good at the point of use.
I am NOT looking for a solder paste handling procedure, what I am looking for is what type of test can be performed that is quick, easy, and does not hold up production. We do paste viscosity testing on each lot that we receive, and we also strictly monitor our paste printing process with the post-print inspection machine. We have validated our entire solder paste handling system to ensure that the paste is handled, labeled, and properly rotated.
We have had no issues with the solder paste that we use.
Our customer thinks we should test each lot of paste when it is removed from refrigeration prior to use on production hardware. I am not really sure what a second viscosity check would do for us, but I am open to some other testing method that does not consume a lot of paste and would provide data we can use.
Any suggestions?
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