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June 2009

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 24 Jun 2009 11:25:31 -0500
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Hi Genny - I would conduct a IPC JSTD-003 Test Method S assessment of the 
solderability.

Dave Hillman
Rockwell Collins 
[log in to unmask]




Genny Gibbard <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
06/24/2009 11:16 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Genny Gibbard <[log in to unmask]>


To
[log in to unmask]
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Subject
[TN] Immersion Tin solderability eval






We have some Immersion Tin boards that are several years old.  From
everything I have read here or elsewhere, ImmSn is supposed to have a
short shelf life.  6 mos to a year.  No one wants to scrap the boards
without testing them, though. 
How would you verify whether they are still good?  We hand-soldered some
pads and actually had no problems which surprised me, considering the
age of the boards, but I don't know if that is a valid test.

Genny 

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