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June 2009

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Wed, 24 Jun 2009 10:56:38 -0400
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Hi Lenny,

Assuming that you are using FR4 material 100% Sn HASL (~300°C) will degrade
the material significantly. I would expect frank delamination. The PWB
failure mode is delamination, in the field the board would be prone to CAF
and failure due to shorting.

Paul Reid 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lenny Carter
Sent: Wednesday, June 24, 2009 8:13 AM
To: [log in to unmask]
Subject: [TN] ENIG and SN100 HASL compatability?

Fellow Technetters- We design, build and ship our own electronic assys from
one lean facility in the US.  3-4 years ago went ROHS like most others, and
we settled on ENIG pcb finish and havent looked back.  We have a pcb
manufacturer who wants us to try some SN100 finished ROHS pcbs as an
alternative to ENIG for the few pcbs we by from him.
I have some sample arrays to build on, but the assys are expensive and
figured I would first ask those of you who know-  Is SN100 HASL finish
common? and is it fairly interchangeable with ENIG from a paste and
component finish compatibility and process perspective?  Are others readily
building between SN100 & ENIG assys with little or no changes?
I understand this is a very subjective questions with many variables, but I
am posting this as a starting point.
Thanks, Lenny Carter

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