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June 2009

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Wed, 24 Jun 2009 09:34:47 +0800
Content-Type:
text/plain
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text/plain (98 lines)
Re-design the stencil opening into two or more section as compared to
one whole opening. It will help.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Wednesday, 24 June 2009 3:37 AM
To: [log in to unmask]
Subject: Re: [TN] Float Electrolytic Caps

Check solderability of the component terminals. 
If the part does not accept solder well it may float off the pad before
it
begins to wet. But, I would expect the part to shift to the side too. 

Guy

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Russell Nowland
Sent: Friday, June 19, 2009 11:32 AM
To: [log in to unmask]
Subject: [TN] Float Electrolytic Caps

Hello everyone,

I have an entering situation that my EMS has not been able to figure
out.

We use several SMT Electrolytic Capacitors that are sliding off of the
pads.

The pad design is per the recommended my the device suppliers and also 
comply with our normal design parameters.  The issue is the device wants
to 
slide toward the heel and toe so you end up with pad overhang and
clearance 
issues.  The pad design is narrow enough that it is not twisting.

My EMS's current solution is to apply a couple of glue dots under the
device

to secure it before the solder reflows.  I am not real crazy for this
process for 
several reasons but they asked permision and it does not violate any 
requirements.

Have any of you seen this and how are you handling it?  Hopefully
without 
glue.

Thanks

Russ Nowland

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