Hello everyone,

I have an entering situation that my EMS has not been able to figure out.

We use several SMT Electrolytic Capacitors that are sliding off of the pads.  
The pad design is per the recommended my the device suppliers and also 
comply with our normal design parameters.  The issue is the device wants to 
slide toward the heel and toe so you end up with pad overhang and clearance 
issues.  The pad design is narrow enough that it is not twisting.

My EMS's current solution is to apply a couple of glue dots under the device 
to secure it before the solder reflows.  I am not real crazy for this process for 
several reasons but they asked permision and it does not violate any 
requirements.

Have any of you seen this and how are you handling it?  Hopefully without 
glue.

Thanks

Russ Nowland

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