Dear Technetters,
Our assembly workshop has to assemble 4 prototype boards where LGA
packages with 133 connections are used. I allready worked with BGAs or
QFNs but never with LGA packages and I am concerned about shorts/open
that could occur.

Provided that I cannot run tests and conditions are as followed:
- ENIG surface finish boards
- Vapor phase reflow soldering
- Pick and Place machine
- Leadfree or lead containing solder can be used

Would some of you be kind enough to share experiences/advices so that we
would have little chances to successfuly assemble these boards?

Thank you in advance for your help.

S. Kaufmann

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Sylvain Kaufmann
CERN / European laboratory for particle physics Site de Meyrin
1211 Geneva 23
Switzerland
Dpt: EN-ICE-DEM (int mail J06600)
Phone: +41 22 767 37 02
Fax: +41 22 766 87 77
E-mail: [log in to unmask]
Web: www.cern.ch
http://cern.ch/dem
************************************************************

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