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Date: | Wed, 17 Jun 2009 11:06:38 -0700 |
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Steve,
Great pictures. I come into this discussion late but what I see looks
like the pad during soldering must have expanded more than the laminate
could tolerate. In the article you sent there did not seem to be enough
resin in the laminant, it appears that the copper separates from the glass
bundles directly and I would say that the material was questionable.
In Genny's pictures it looks like a chunk of resin is pulled away from the
glass and that indicates a large expansion of the pad to create that
tearing.
Just my thoughts,
Chuck Brummer
3M Manufacturing Engineer
8357 Canoga Ave.
Canoga Park, CA 91304-2605
(818) 734-4930
Steve Gregory <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/15/2009 10:12 AM
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Re: [TN] image adjusted
Hi Joe,
I think that the last image that Genny sent me was darker than the first
two so that you could see that the solder ball was soldered fine at the
device to ball interface and at the ball to pad interface. I don't think
there was anything wrong with the solder joint...
I believe that the cratering she was talking about was shown in her
first two photos in the laminate just beneath the PCB pads
http://stevezeva.homestead.com/files/crack_bright_100x.jpg
http://stevezeva.homestead.com/files/crack_bright_200x.jpg
Genny, correct me if I'm wrong?
Steve
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, June 15, 2009 11:37 AM
To: Steve Gregory
Subject: image adjusted
Hi Steve
I adjusted the image to see better. Other than the small voids I am
curious what is being seen. There seems to be no cratering
Cheers,
Joe
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