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June 2009

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
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Date:
Mon, 15 Jun 2009 18:44:05 +0000
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Hi Bill,





What might be happening is that the layer of HASL is too thin and almost all Sn is consumed to form intermetallics. You wouldn't see any contamination on the surface, but would have trouble soldering to it, unless a fresh surface is exposed (the surface is scrubbed).



I would be able to confirm that if I had a sample.



Regards,



Vladimir

SENTEC

SENTEC

11 Canadian Road, Unit 7.

Scarborough, ON M1R 5G1

Tel: (416) 899-1882

Fax: (905) 882-8812

www.sentec.ca





-----Original Message-----

From: Bev Christian <[log in to unmask]>



Date:         Mon, 15 Jun 2009 14:27:39 

To: <[log in to unmask]>

Subject: Re: [TN] Fw: [TN] HAL-Leaded assembly





Bill,

No prob. I should have been able to figure that out. I'm just used to

seeing HASL.

Bev



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bill Dworak

Sent: Monday, June 15, 2009 2:16 PM

To: [log in to unmask]

Subject: [TN] Fw: [TN] HAL-Leaded assembly



Sorry Bev, I am guilty of using terminology that is specific to my end

of 

the industry. Hot air leveling (HAL) leaded, means that the surface

finish 

is tin lead , I defined it as leaded because there is a leaded as well

as 

non-leaded surface finish out there now. This is a military account so

we 

cannot use no-lead. I did leave out the materials used typically it has

been 

FR4, 130 as well as 170.

 Sorry.



 Bill





----- Original Message ----- 

From: "Bev Christian" <[log in to unmask]>

To: <[log in to unmask]>; <[log in to unmask]>

Sent: Monday, June 15, 2009 10:53 AM

Subject: Re: [TN] HAL-Leaded assembly





Bill,

Not enough info!

What surface finish?

What board type?

What environment boards stored in?

How long between manufacture of boards and use?

Bev

RIM



----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Mon Jun 15 13:47:51 2009

Subject: [TN] HAL-Leaded assembly



Hello everybody, I am looking for some knowledge on what I see is a

basic 

type problem that is driving me crazy. I am a sales guy who covers a

sizable 

territory and in that territory for a PCB manufacturer (yes one of

those) I 

have one account that I have been working with for about 4 years now

that 

continuously has issues assembling both hand assembly as well as pick & 

place.

The surface finish is HAL (leaded) this is a military account that is

pretty 

well structured in their processes. What I get told is that there seems

like 

a contamination is on the surface when they scrub the surface it makes

it 

better but not 100% better.They have sent back samples for us to look at

, 

we saw nothing on the surface no contamination nothing wrong at all.

If this was one of a few that has the same or similar issues it would

make 

some sense and I could go to the people I work with asking them to look

into 

this issue. But it is the only company that has this issue.

 Has anybody seen a similar type of a situation before? Understood that

you 

cannot fix this but would appreciate advise as to where to look so

hopefully 

this can be solved.

Thank you.



 Bill Dworak



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