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June 2009

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 15 Jun 2009 13:45:33 EDT
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text/plain
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text/plain (72 lines)
Hi Steve
 
Seeing the "rest of the picture" helps. The first one was cut off short. (I 
 suppose that's one way to make a problem go away... ;-) 
 
Thanks
Joe 
 
 
In a message dated 6/15/2009 10:12:13 A.M. Pacific Daylight Time,  
[log in to unmask] writes:

Hi Joe,
 
I think that the  last image that Genny sent me was darker than the first 
two so that  you could see that the solder ball was soldered fine at the 
device to ball  interface and at the ball to pad interface. I don't think there 
was anything  wrong with the solder joint...
 
I believe that the  cratering she was talking about was shown in her first 
two photos in the  laminate just beneath the PCB pads
 
_http://stevezeva.homestead.com/files/crack_bright_100x.jpg_ 
(http://stevezeva.homestead.com/files/crack_bright_100x.jpg) 
 
_http://stevezeva.homestead.com/files/crack_bright_200x.jpg_ 
(http://stevezeva.homestead.com/files/crack_bright_200x.jpg) 
 
Genny, correct me if  I'm wrong?
 
Steve

 
____________________________________
 From: [log in to unmask] [mailto:[log in to unmask]]  
Sent: Monday, June 15, 2009 11:37 AM
To: Steve  Gregory
Subject: image adjusted



Hi Steve
 
I adjusted the image to see better. Other than the small voids I am  
curious what is being seen. There seems to be no cratering 
 
Cheers, 
Joe

 
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