Hi Joe,
I think that the last image that Genny sent me was darker than the first
two so that you could see that the solder ball was soldered fine at the
device to ball interface and at the ball to pad interface. I don't think
there was anything wrong with the solder joint...
I believe that the cratering she was talking about was shown in her
first two photos in the laminate just beneath the PCB pads
http://stevezeva.homestead.com/files/crack_bright_100x.jpghttp://stevezeva.homestead.com/files/crack_bright_200x.jpg
Genny, correct me if I'm wrong?
Steve
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, June 15, 2009 11:37 AM
To: Steve Gregory
Subject: image adjusted
Hi Steve
I adjusted the image to see better. Other than the small voids I am
curious what is being seen. There seems to be no cratering
Cheers,
Joe
________________________________
An Excellent Credit Score is 750. See Yours in Just 2 Easy Steps!
<http://pr.atwola.com/promoclk/100126575x1221322979x1201367215/aol?redir
=http://www.freecreditreport.com/pm/default.aspx?sc=668072%26hmpgID=62%2
6bcd=JuneExcfooterNO62>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------