Dear all,

Our routine tests for one of our customers include 6X thermal stress on every panel before despatch. Currently we are evaluating a new elctroless chemistry. We would like to have some suggestions from the technetters on which of the electroless chemistries are best suited for meeting the 6X thermal stress tests - Low build / medium build / high build. We do a copper strike after electroless plating and before pattern printing. We also do a plasma desmear followed by a chemical desmear which will achieve an etchback of 5-8 microns. Kindly share any suggestions which you feel will further improve the PTH relaibility. We use 175 Tg laminate and prepreg of Nelco (N4000-6) and achieve a pretty good hole wall during drilling. 

In the past we have had a few instances of innerlayer separation during 3x and 6x thermal cycles. Almost all the panels pass 1x thermal stress.

looking forward for the valuable inputs

Rgds

Pradeep Menon


-------------------------------
Micropack Ltd, Bangalore, India

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------