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June 2009

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Fri, 12 Jun 2009 12:31:49 -0400
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What is the surface finish on the QFN and what is t


Karen,



What is the surface finish on the QFN and what is the PCB surface finish?



Regards,

George

George M. Wenger

Andrew Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]

[log in to unmask]

 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Tellefsen

Sent: Friday, June 12, 2009 11:10 AM

To: [log in to unmask]

Subject: Re: [TN] Strange tin "migration" under OFN soldered with no-clean SAC305 solder paste



I though of creep corrosion also, but  flux contains no sulfur of halide.

That doesn't mean that there is no source of sulfur, but I don't know about

it.



Karen Tellefsen - Electrical Testing

[log in to unmask]

908-791-3069



fabrice pires <[log in to unmask]:



It make me think about creep corrosion phenomena. Is there any sulfur in

the residues?

Just an idea.





Karen Tellefsen a écrit :

> One of our technical service engineers asked me about a strange migration

> phenomenon one of our customers observed under passives and QFN's that

have

> been soldered with one of our no-clean SAC305 solder pastes. I've

attached

> an X-ray picture of a QFN exhibiting this strange failure, but I don't

know

> how it can be posted so you can look at it.. Further analysis after

> removing the component showed that the shadows in the X-ray picture is

> caused by a black material containing tin. The boards were conditioned

85°C

> 85%RH  for 500 hr, but no voltage was applied.  This phenomenon was not

> observed under QFPs (not surprising), and seems to be independent of

reflow

> profile used.  Additionally, the customer has not seen anything like this

> with tin lead solder paste, however, the tin-lead solder pastes would

have

> a different fluxes.   The tin "migration" is coming from both adjacent

> solder joints, and there is no voltage applied, so it seems to be a

> corrosion problem.  Certainly QFN and big passives are good at trapping

and

> retaining water in the flux residue underneath them.

>

> I've never seen anything like this; has anyone else out in TechNet land

> seen this or have any ideas what caused this?

>

> Thanks

>

> Karen Tellefsen - Electrical Testing

> [log in to unmask]

> 908-791-3069









Enthone GmbH  Geschäftsführer: Knut Balzer, Luc de Croo, Jürgen Dietrich  Amtsgericht Düsseldorf  HRB 45276

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