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June 2009

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Subject:
From:
Anil kher <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Anil kher <[log in to unmask]>
Date:
Thu, 11 Jun 2009 11:08:00 +0530
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Harris 

Adding to all info immersion is less than 0.05 um over copper or Nickel. It
may not always provide good solderability or corrosion resistance if the
shop is poorly managed. Electrolytic Gold can be controlled to within 10% of
specified thickness ranging from 0.05 to 5 um and can offer multiple
properties as soft/ hard/ Co or Ni alloyed and preferable over 3 to 5 um
Nickel plate. A pcb can be finished with solderable area at 0.05 um and
wiper/ contact area with 0.5 or upto 5 um.

Electrolytic finish has no quality issues but costs may be higher. With the
price of gold at 1000$ it is a freak who will give more than 10% of spec
thickness.
Anil 

-----Original Message-----
From: Harris Dy [mailto:[log in to unmask]] 
Sent: Wednesday, June 10, 2009 23:02
Subject: Immersion Gold versus Electrolytic Gold

Hi guys,
 
Can you please help to differentiate the two surface finishes? Also, is
Electrolytic Gold done in Cu-Ni-Au plating line or there is another way?
 
Thanks in advance,
Harris


 


      

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