Hi Steve,
I think photoresist needed for two main reasons - purpose of electrolytic
gold plating ( its selectivity) and cost of the gold.
Aleks Lozinsky
Technic Canada
----- Original Message -----
From: "Steve Kelly" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, June 10, 2009 4:00 PM
Subject: Re: [TN] Immersion Gold versus Electrolytic Gold
> Hi Rudy,
> We electroplate gold everyday with no photoresist- why would you need a
> photoresist in the electroplate area? Regards Steve Kelly
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
> Sent: June-10-09 3:19 PM
> To: [log in to unmask]
> Subject: Re: [TN] Immersion Gold versus Electrolytic Gold
>
> Harris:
>
> Perhaps the single biggest difference between electrolytic and immersion
> gold, besides the self-limiting aspect of immersion gold, thus limiting
> thickness, is that immersion gold covers the entire trace, including
> sides. Electrolytic gold must be applied with a photoresist on the board,
> and thus the sides of the traces are exposed Copper.
>
> Electrolytic gold is applied on top of electrolytic Nickel MOST of the
> time,
> there are some people doing direct gold on top of Copper, but it is quite
> thick. Plating Copper under the Nickel is unnecessary.
>
> Rudy Sedlak
> RD Chemical Company
>
> --- On Wed, 6/10/09, Harris Dy <[log in to unmask]> wrote:
>
> From: Harris Dy <[log in to unmask]>
> Subject: [TN] Immersion Gold versus Electrolytic Gold
> To: [log in to unmask]
> Date: Wednesday, June 10, 2009, 10:31 AM
>
> Hi guys,
>
> Can you please help to differentiate the two surface finishes? Also, is
> Electrolytic Gold done in Cu-Ni-Au plating line or there is another way?
>
> Thanks in advance,
> Harris
>
>
>
>
>
>
>
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