I guess it depends on what the end use really is. Hard gold or soft gold?
Immersion is most used for surface finish for future solderable conditions
and ED gold is used for card edge connectors that require more durability
and thickness.
www.quickturnflex.com
Thank you,
Jim Mahoney
Quick Turn Flex Circuits, LLC
Applications Project Manager
P# 603-821-7071
M# 603-305-6250
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Wednesday, June 10, 2009 3:19 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion Gold versus Electrolytic Gold
Harris:
Perhaps the single biggest difference between electrolytic and immersion
gold, besides the self-limiting aspect of immersion gold, thus limiting
thickness, is that immersion gold covers the entire trace, including
sides. Electrolytic gold must be applied with a photoresist on the board,
and thus the sides of the traces are exposed Copper.
Electrolytic gold is applied on top of electrolytic Nickel MOST of the time,
there are some people doing direct gold on top of Copper, but it is quite
thick. Plating Copper under the Nickel is unnecessary.
Rudy Sedlak
RD Chemical Company
--- On Wed, 6/10/09, Harris Dy <[log in to unmask]> wrote:
From: Harris Dy <[log in to unmask]>
Subject: [TN] Immersion Gold versus Electrolytic Gold
To: [log in to unmask]
Date: Wednesday, June 10, 2009, 10:31 AM
Hi guys,
Can you please help to differentiate the two surface finishes? Also, is
Electrolytic Gold done in Cu-Ni-Au plating line or there is another way?
Thanks in advance,
Harris
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