Whenever possible we use Chipbonder adhesive and keep the TC Assembly
handy for future verification of oven performance.
On Wed, Jun 10, 2009 at 8:17 AM, John Queen<[log in to unmask]> wrote:
> For PB none of them are ideal, we don't use thermo couples on our boards due
> to the PPT of the component but if you need to use a TC glue is probably
> preferred and consider the percentage of deviation that the TC reports.
>
> john
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
> Sent: 10 June 2009 14:16
> To: [log in to unmask]
> Subject: Re: [TN] Profiling compound?
>
> I have obtained repeatable results by using Al tape to stick the
> thermocouple to the board and using Kapton tape over it to maintain adhesion
> at high temps.
>
> Regards,
> Amol
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK)
> Sent: Wednesday, June 10, 2009 5:34 AM
> To: [log in to unmask]
> Subject: [TN] Profiling compound?
>
> Hi all,
>
> What is the preferred medium for bonding thermocouples to boards for
> PbFree thermal profiling - forced convection!
>
> CIA,
> Iain
>
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