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June 2009

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Subject:
From:
Kevin Glidden <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kevin Glidden <[log in to unmask]>
Date:
Wed, 10 Jun 2009 10:11:17 -0400
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text/plain (109 lines)
2nd for the Loctite 384....

I've not received good results with tapes and dots - I always seem to lose a
T/C mid run - very frustrating.
 

-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]] 
Sent: Wednesday, June 10, 2009 9:18 AM
To: [log in to unmask]
Subject: Re: [TN] Profiling compound?

It depends:   Loctite 384 & activator 7387 for some applications.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Fox, Ian
Sent: Wednesday, June 10, 2009 8:01 AM
To: [log in to unmask]
Subject: Re: [TN] Profiling compound?

Hi Iain, we always use high melting point solder (88Pb10Sn2Ag usually)

Regards
Ian Fox
Lead Materials and Process Engineer
Aero Engine Controls
A Rolls-Royce plc and Goodrich Corporation Joint Venture
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK)
Sent: 10 June 2009 10:34
To: [log in to unmask]
Subject: [TN] Profiling compound?

Hi all,
 
What is the preferred medium for bonding thermocouples to boards for PbFree
thermal profiling - forced convection!
 
CIA,
    Iain

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