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June 2009

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Subject:
From:
"Fox, Ian" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Fox, Ian
Date:
Wed, 10 Jun 2009 14:01:28 +0100
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Hi Iain, we always use high melting point solder (88Pb10Sn2Ag usually)

Regards
Ian Fox
Lead Materials and Process Engineer
Aero Engine Controls
A Rolls-Royce plc and Goodrich Corporation Joint Venture
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK)
Sent: 10 June 2009 10:34
To: [log in to unmask]
Subject: [TN] Profiling compound?

Hi all,
 
What is the preferred medium for bonding thermocouples to boards for
PbFree thermal profiling - forced convection!
 
CIA,
    Iain

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