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June 2009

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Subject:
From:
"Braddock, Iain (UK)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Braddock, Iain (UK)
Date:
Wed, 10 Jun 2009 10:33:54 +0100
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Hi all,
 
What is the preferred medium for bonding thermocouples to boards for
PbFree thermal profiling - forced convection!
 
CIA,
    Iain

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