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June 2009

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 9 Jun 2009 08:21:51 -0400
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We have the following requirement on one of our space programs:

All glass-bodied electronic parts which are bonded, encapsulated or
conformally coated shall be sleeved with sleeving that remains resilient
over the temperature range specified for the equipment. Surface mount,
non-axially leaded, glass-bodied diodes that are conformally coated do
not require sleeving if the coating Tg is below all application and test
temperatures.

I am confident that this came from NASA STD 8739.1A as well as the IPC
Space Addendum. The question is why? Have there been documented failures
of glass-bodied electronic parts without sleeving which failed when
conformal coating was applied?

Should glass-bodied components be masked from conformal coating?

Thanks again...

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]

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