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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Mon, 8 Jun 2009 08:38:19 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (2084 lines)
?  Richard,
I do not understand your question.
Bev

-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]] 
Sent: Monday, June 08, 2009 8:36 AM
To: TechNet E-Mail Forum; Bev Christian
Subject: RE: [TN] Underfill Workmanship Pass/fail Criteria Proposal-comments from proto/rework

Good point, Bev. So what difference does it make?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Monday, June 08, 2009 7:31 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal-comments from proto/rework

Richard,
It is true that a good x-ray system can see through RF shields, but pray tell what kind of x-ray system do you have that can find an epoxy underfill?  Or is yours filled with lead dust?  :)
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, June 08, 2009 8:18 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal-comments from proto/rework

A good X-ray can see through most RF shields.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of bob wettermann
Sent: Friday, June 05, 2009 4:54 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal-comments from proto/rework

All:
Our staff comments in CAPS.
Regards
 
Bob Wettermann
 
Workmanship Standards for BGA and CSP Underfills


GENERAL COMMENT. IN MANY CASES THE DEVICES WHICH ARE UNDERFILLED ARE PLACED UNDERNEATH RF SIELDS THEREFORE THEIR INPSECTION THROUGH VISUAL MEANS IS IMPOSSIBLE WITHOUT EXPENSIVE TOOLS. THERE SHOULD BE A CAVEAT TO THIS INSPECTION CRITERIA WHERE ONLY IF THE COMPONENT CAN BE VISUALLY INSPECTED (IE 2-PIECE OR WINDOW SHIELD, DEVICES NOT UNDER SHIELDS) SHOULD THESE INSPECTION CRITERIA APPLY. THIS WILL ALLOW THE SPECIFICATION TO BE APLIED TO ALL FIRMS LARGE AND SMALL. (SEE PREVIOUSLY PROPOSED LAMINOGRAPHIC XRAY INSPECTION CRITERIA WHICH WERE VOTED DOWN IN REV D)

Target - Class 1,2,3
*    Component requiring under fill completely underfilled with a good fillet all the way around, the fillet just approaching the maximum component body height, completely cured, no encroachment onto other components and no voiding whatsoever
THIS WILL CAUSE A  BURDEN ON SMALLER FIRMS AS ACCOUSTIC IMAGING IS CAPITAL INTENSIVE

Acceptable - Class 3
*    At least 50% fillet height up the side of the component body

*    Small pin holes and voids are permissible provided they do not exceed 5% of fillet surface area and have a maximum diameter of 0.5 mm (0.020 inches).
HOW WILL THIS BE PRACTICALLY MEASURED......MOST SMALLER AND EVEN MEDIUM CM'S DO NOT HAVE THIS CAPABILITY

Acceptable - Class 1,2
*    Component requiring underfill underfilled such that all balls are covered, but no evidence of an exterior fillet, no encroachment onto other components and no voiding whatsoever

*    Component requiring underfill underfilled such that all balls are covered, with or without an exterior fillet, no encroachment onto other components and only small voids, not touching any solder joints

*    Component requiring underfill underfilled such that all balls are covered, with or without an exterior fillet, no encroachment onto other components and even large voiding, but not touching any solder joints

*    A void or voids less than or equal to 50% around the perimeter of one or more solder joints

Defect - Class 1,2,3
*    Underfill completely missing from components where it is required

*    Underfill not completely covering all the peripheral solder joints

*    Voiding such that a void traverses the distance between two or more solder joints under the array device requiring underfill

*    A void or voids more than 50% around the perimeter of one or more solder joints

*    Material extending on to the top of the BGA or CSP

*    Uncured material
 
ADD: UNDERFILL MATERIAL EXTENDING ONTO OTHER DEVICES  

Special Conditions - Class 1,2
*    Encroachment onto other components, but meeting all other criteria above for target or acceptable conditions will be dealt with as a pass/fail on a case-by-case basis 

*    Underfill interfering with proper placement of heatsink OR OTHER MOUNTED OR MECHANICAL DEVICES THAT WOULD INTERFERE WITH THE ASSEMBLY.

*    There should be no evidence of underfill flowing out through holes
under the device.

*    After curing there should be no visual evidence of cracks between
the device surface, underfill or board.

*    There should be no evidence of damage to the board or device caused
by contact with the dispensing needle or height sensor.

*    Underfill filler shows evidence of separation




Bob Wettermann
PH 847-767-5745

--- On Fri, 6/5/09, Whittaker, Dewey (EHCOE) <[log in to unmask]> wrote:


From: Whittaker, Dewey (EHCOE) <[log in to unmask]>
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
To: [log in to unmask]
Date: Friday, June 5, 2009, 4:45 PM


Osmosis is a potentially correct technical answer.

Oz Moses is a reference to Bev's out of this world bewilderment of the
following (I know it would be more appropriate in a tabular format):

*         Syed's ability to pull water out (parting of Red Sea)

*         Why a Canadian was no longer in Kansas

*         The strange movie parallels of the Wizard of Oz and the Ten
Commandments

*         That a yellow brick road lead to the only place that had no
water or oil



Dewey 



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Friday, June 05, 2009 2:13 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Never heard of Oz Moses

Inge

----- Original Message ----- 

From: "Whittaker, Dewey (EHCOE)" <[log in to unmask]>

To: <[log in to unmask]>

Sent: Friday, June 05, 2009 10:47 PM

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal





Ozmosis.

Dewey



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Friday, June 05, 2009 12:24 PM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Syed,

How in the world are you going to get water in fully enclosed voids

underneath a component?

Bev



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Syed Ahmad

Sent: Friday, June 05, 2009 3:05 PM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



So, if water gathers in the voids and the part powers up to above 100

degC,

the boiling water does not do anything to the system?



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Friday, June 05, 2009 1:14 PM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Chris,

To your last point, if the internal structure of the underfill is like

Swiss cheese but the voids don't touch a solder joint, why should I

care?



Your first point, is an excellent one.  I guess it comes down to whether

this becomes a part of 610 (essentially visual only) or gets added into

a larger underfill doc of Brian Toleno's committee or is a stand-alone

doc.  If one of the latter two, then we can include things that are not

strictly visual only.

Bev

RIM

-----Original Message-----

From: Chris Mahanna [mailto:[log in to unmask]]

Sent: Friday, June 05, 2009 1:54 PM

To: TechNet E-Mail Forum; Bev Christian

Subject: RE: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Hey Bev,

Good stuff.  I'll post my concerns and see if anybody bites.  As with

many J-STD-001/610 requirements, one has to be careful about defining

attributes that we are optically blind to.  The problem (as I see it,

ha) is that nondestructive inspection techniques like x-ray and

acoustics typically provide far less resolution and contrast than what

we have in our mind's eye.  Therefore the discrimination between

acceptable and not becomes a different animal.



So, I'm wondering if anyone has information about the uncertainty of

measuring artifacts like the ones below?

You want test- I do test, but I'm always worried about indeterminable

conformance.



*void 50% around the perimeter of one or more solder joints

*void traverses the distance between two or more solder joints under the

array device



Also, how about simple area percentage criteria after taring-out the

balls?



Chris



Chris Mahanna

Robisan Laboratory Inc.











-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Friday, June 05, 2009 11:52 AM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Bob and other TechNetters,

I have taken what has been said and added, especially from Bob's work,

more failure criteria for all classes of products. Here they are:



*       Underfill interfering with proper placement of heatsink



*       There should be no evidence of underfill flowing out through

holes under the device.



*       After curing there should be no visual evidence of cracks

between the device surface, underfill or board.



*       There should be no evidence of damage to the board or device

caused by contact with the dispensing needle or height sensor.



*       Underfill filler shows evidence of separation



I have still no definitive statements about small amounts of underfill

on an upper horizontal surface of a component (Graham Collin's issue).

Note I did not necessarily mean the top of the component. And the second

one is underfill on surrounding components.  Remember us handset people

have NO SPACE.  Forget about keep-out zones for needle maneuver!



Further comments?



Bev





-----Original Message-----

From: Bob Willis [mailto:[log in to unmask]]

Sent: Friday, June 05, 2009 2:54 AM

To: 'TechNet E-Mail Forum'; Bev Christian

Subject: RE: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Bev I am very sorry but I did not send my old text as I agreed after my

trip, I just could not find it as it dated back to May 2001. I never

sorted out the images for the flip chip and uBGA from my libarary for

the posters/wall charts.



The draft text is below which I actually found on line at SMTNet Forum

with three comments see link:



http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&T

hrea

d_ID=1600&#Message6706









Here is a draft visual inspection guide for underfill, please pass this

on to the relevant people for any comments or suggestions. I am

currently working on the pictures to go with the reference guide.



Flip Chip/uBGA Underfill Visual Standards



The aim of this document is to produce some draft text and then select

photographs to make up a draft visual standard for inspection. There is

also a need to produce some reference material for C Scan images.



The following images provide a guide to the inspection requirement after

the underfilling operation. They may also be applied after curing of the

underfill.



CLASSIFICATION OF QUALITY STANDARDS



During the assessment the following classifications, which are

pictorially illustrated, should apply:



SATISFACTORY



This is a satisfactory condition which should be achieved and used as

the standard for manufacture.



ACCEPTABLE



This condition represents the maximum acceptable departure from the

"Satisfactory" condition. Examples within this limit of deviation will

not require reworking. Individual clarification accompanies each example

illustration. Consideration should be given to modification to the

process materials or conditions.



UNACCEPTABLE



This applies to an unacceptable condition which should not be reworked

without the cause of the fault being established. Rework may be possible

after assessment of the fault and corrective action taken on the

process.

Flip Chip/uBGA Underfill Visual Standards



Satisfactory

The underfill should be visible at the edge of the device and extend

completely around the perimeter.



Satisfactory

The underfill should be visible on all four sides, there may be evidence

of more material on one or two sides to aid complete filling of device

base.



Satisfactory

The underfill if by design should be visible on the side of the device

and reach a minimum height of 25% of the thickness of the package.



Satisfactory

The base of the device should be completely filled with no evidence of

voids in the underfill or solder joints being visible around the

perimeter of the device.



Satisfactory

Curing of the underfill material should be compared with the reference

colour standards. Evidence of colour change illustrates a correctly

cured sample.



Acceptable

Flow out of underfill from the device is acceptable provided that it

does not completely cover any solder joints. Flow out on to test points,

through holes is unacceptable and needs to be reworked and the process

modified.





Acceptable

Small bubbles in the surface of the underfill fillet is acceptable

provided that no solder joint is visible.



Acceptable

Evidence of a needle dispense pattern around the device is acceptable,

the width of the pattern should be kept to a minimum.



Acceptable

The underfill if by design should be visible on the side of the device

and reach a height of no less than 20% of the thickness of the package

in the centre of any side.



Acceptable

Underfill fillets which are not visible on the side of the device are

not rejectable, however modifications to the dispense process should be

made



Unacceptable

There is no evidence of underfill on the top side of the device



Unacceptable

Curing of the underfill should be compared with the reference colour

standards. No evidence of colour change is unacceptable.



Unacceptable

The underfill is not visible along the complete side of any device



Unacceptable

Solder joints are visible without underfill on the side of the device



Unacceptable

There should be no evidence of underfill flowing out through holes under

the device.



Unacceptable

After curing there should be no visual evidence of cracks between the

device surface, underfill or board.



Unacceptable

There should be no evidence of damage to the board or device caused by

contact with the dispensing needle or height sensor.



When using CSAM to asses the underfilling/curing process the following

criteria may apply:



Satisfactory

Underfill is complete and there is no evidence of voiding between the

device and the board.



Acceptable

Underfill is complete and there is evidence of small voids of less than

50% of the solder bump diameter. There is no evidence of voids around

solder joints.



Unacceptable

After curing there should be no evidence of cracks between the device

surface, underfill or board.



Unacceptable

Underfill is incomplete and there is evidence of voids around or between

the solder joints



Unacceptable

Underfill is complete but there is evidence of voids which are larger

than 50% of the solder bump



Unacceptable

Underfill filler shows evidence of separation or uneven flow and will

expansion matching and affect the long-term reliability.





Draft Produced by Bob Willis

28/5/2001 Issue 4.





Bob Willis

2 Fourth Ave, Chelmsford, Essex, CM1 4HA England

Tel: (44) 1245 351502

Fax: (44) 1245 496123

Mobile: 07860 775858

www.ASKbobwillis.com

www.SolderingStandards.com



PCB Design for Manufacture & Assembly Workshop 15th October

www.ASKbobwillis.com PCB Inspection & Quality Control Workshop 3rd

November www.ASKbobwillis.com/faworkshops.pdf

Book Bob's "Step by Step Failure Analysis Workshop" 4th November

www.ASKbobwillis.com/faworkshops.pdf

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: 04 June 2009 21:45

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Bob,

This is weird. You are the second TechNetter to ask for the draft

document, which I posted on TechNet this morning at 11:07 AM EDST.  Here

it is again.

Bev

RIM





Workmanship Standards for BGA and CSP Underfills



Target - Class 1,2,3

*       Component requiring underfill completely underfilled with a good

fillet all the way around, the fillet just approaching the maximum

component body height, completely cured, no encroachment onto other

components and no voiding whatsoever



Acceptable - Class 3

*       At least 50% fillet height up the side of the component body



*       Small pin holes and voids are permissible provided they do not

exceed 5% of fillet surface area and have a maximum diameter of 0.5 mm

(0.020 inches).



Acceptable - Class 1,2

*       Component requiring underfill underfilled such that all balls

are

covered, but no evidence of an exterior fillet, no encroachment onto

other components and no voiding whatsoever



*       Component requiring underfill underfilled such that all balls

are

covered, with or without an exterior fillet, no encroachment onto other

components and only small voids, not touching any solder joints



*       Component requiring underfill underfilled such that all balls

are

covered, with or without an exterior fillet, no encroachment onto other

components and even large voiding, but not touching any solder joints



*       A void or voids less than or equal to 50% around the perimeter

of

one or more solder joints



Defect - Class 1,2,3

*       Underfill completely missing from components where it is

required



*       Underfill not completely covering all the peripheral solder

joints



*       Voiding such that a void traverses the distance between two or

more

solder joints under the array device requiring underfill



*       A void or voids more than 50% around the perimeter of one or

more

solder joints



*       Material extending on to the top of the BGA or CSP



*       Uncured material



Special Conditions - Class 1,2

*       Encroachment onto other components, but meeting all other

criteria

above for target or acceptable conditions will be dealt with as a

pass/fail on a case-by-case basis



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of bob wettermann

Sent: Thursday, June 04, 2009 4:42 PM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Dear Richard:



Pls send the proposal on to us. We perform underfill rework and this

issue presents itslf fairly frequently.



Thanks



Bob Wettermann

[log in to unmask]



Bob Wettermann

PH 847-767-5745



--- On Thu, 6/4/09, Stadem, Richard D. <[log in to unmask]>

wrote:





From: Stadem, Richard D. <[log in to unmask]>

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal

To: [log in to unmask]

Date: Thursday, June 4, 2009, 1:10 PM





I reviewed the proposed items for the standard and I think it looks

great. I have sent it to several other people directly involved in BGA,

CSP, and flipchip underfill at various companies in Minnesota for their

review and will pass on their comments as well.

Thank you for doing all of this work.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Thursday, June 04, 2009 11:43 AM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



The doc we are discussing is only for CSPs and BGAs. I did not want to

try and tackle too much, especially something that:

a) I don't know about

b) Has been around a lot longer and might already have a set of

pass/fail criteria



Bev

RIM



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman

Sent: Thursday, June 04, 2009 12:40 PM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Hi Graham - in the words of Sir Doug, "it depends"! Under most

situations, that thin of underfill will have no influence on the solder

joint integrity. However, a specific component construction may not be

happy with any underfill on its top causing issues. The simple way to

avoid the question is to not allow underfill on the top of the BGA or

CSP. I can't



speak for a flip chip as I don't have any underfill experience in that

realm.



Dave







Graham Collins <[log in to unmask]> Sent by: TechNet

<[log in to unmask]>

06/04/2009 11:20 AM

Please respond to

TechNet E-Mail Forum <[log in to unmask]>; Please respond to

[log in to unmask]





To

[log in to unmask]

cc



Subject

Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal













Absolutely.  If material interferes with installing heatsinks, it's

unacceptable.  But that would be true also of other methods like corner

bonding.



My question: would a thin film of underfill material, say a thou or two,

on a small section (say 15% of the top area) of a BGA have any impact to

reliability?  I am not talking about having big globs of the stuff on

top (although I still wonder how that would influence reliability).



In terms of impacting reliability, I think a more important criteria

would be that the underfill be even volume on each side (so the part

would be underfilled reasonably symmetrically).  Same size fillets on

opposing sides.



regards,

- Graham



-----Original Message-----

From: [log in to unmask] [mailto:[log in to unmask]]

Sent: Thursday, June 04, 2009 1:12 PM

To: [log in to unmask]; Collins, Graham (FN) @ ESI

Subject: RE: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Too much material over the top of the component many add uncalculated

thickness when installing a heat sinks.



Vic,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins

Sent: Thursday, June 04, 2009 11:01 AM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



How?  And to what extent??  Would a tiny bit of underfill on one corner

hurt the reliability?  Are you talking about big lumps of underfill, or

a thin skin?



The underfill we use is pretty thin, runs everywhere if allowed to, and

will form a thin coating on top if it gets there.



regards,

- Graham



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.

Sent: Thursday, June 04, 2009 12:41 PM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Yes, having some on top of the component hurts the reliability.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins

Sent: Thursday, June 04, 2009 10:27 AM

To: [log in to unmask]

Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal



Hi Bev

Why would material on the component top be considered a defect?  Process

indicator I can see, but does it impact reliability?



regards,

- Graham



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Thursday, June 04, 2009 12:07 PM

To: [log in to unmask]

Subject: [TN] Underfill Workmanship Pass/fail Criteria Proposal



TechNetters,

OK after speaking to a couple of industry friends, this is what we have

come up with. I will leave it to them to speak up and identify

themselves, if they wish.  I have written this up in IPC-A-610 format

and have tried to cover all situations for Class 2 and 3 products in

particular.



If we can nail this, I would like to present this to the IPC as the

first IPC draft doc essentially hammered out by out TechNet community.



Comments readily accepted!

Bev

RIM





Workmanship Standards for BGA and CSP Underfills



Target - Class 1,2,3

*                Component requiring underfill completely underfilled

with

a good

fillet all the way around, the fillet just approaching the maximum

component body height, completely cured, no encroachment onto other

components and no voiding whatsoever



Acceptable - Class 3

*                At least 50% fillet height up the side of the component



body



*                Small pin holes and voids are permissible provided they



do not

exceed 5% of fillet surface area and have a maximum diameter of 0.5 mm

(0.020 inches).



Acceptable - Class 1,2

*                Component requiring underfill underfilled such that all



balls

are covered, but no evidence of an exterior fillet, no encroachment onto

other components and no voiding whatsoever



*                Component requiring underfill underfilled such that all



balls

are covered, with or without an exterior fillet, no encroachment onto

other components and only small voids, not touching any solder joints



*                Component requiring underfill underfilled such that all



balls

are covered, with or without an exterior fillet, no encroachment onto

other components and even large voiding, but not touching any solder

joints



*                A void or voids less than or equal to 50% around the

perimeter

of one or more solder joints



Defect - Class 1,2,3

*                Underfill completely missing from components where it

is

required



*                Underfill not completely covering all the peripheral

solder

joints



*                Voiding such that a void traverses the distance between



two or

more solder joints under the array device requiring underfill



*                A void or voids more than 50% around the perimeter of

one

or

more solder joints



*                Material extending on to the top of the BGA or CSP



*                Uncured material



Special Conditions - Class 1,2

*                Encroachment onto other components, but meeting all

other

criteria above for target or acceptable conditions will be dealt with as

a pass/fail on a case-by-case basis



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