We don't want to get Leo too tense, but some of the stuff that has come
out lately calls for TP so maybe it's time to get the wikiup.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Friday, June 05, 2009 11:57 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
LOVE IT!!? Standards by wiki!!?? This has been suggested to the IPC
Technical Activities Committee in the past, and here is a true example.?
Leo Lambert, here comes the new IPC standards methodology!!
Denny Fritz
-----Original Message-----
From: Bev Christian <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 4 Jun 2009 4:44 pm
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Bob,
This is weird. You are the second TechNetter to ask for the draft
document,
which I posted on TechNet this morning at 11:07 AM EDST. Here it is
again.
Bev
RIM
Workmanship Standards for BGA and CSP Underfills
Target - Class 1,2,3
* Component requiring underfill completely underfilled with a good
fillet all
the way around, the fillet just approaching the maximum component body
height,
completely cured, no encroachment onto other components and no voiding
whatsoever
Acceptable - Class 3
* At least 50% fillet height up the side of the component body
* Small pin holes and voids are permissible provided they do not
exceed 5% of
fillet surface area and have a maximum diameter of 0.5 mm (0.020
inches).
Acceptable - Class 1,2
* Component requiring underfill underfilled such that all balls are
covered,
but no evidence of an exterior fillet, no encroachment onto other
components and
no voiding whatsoever
* Component requiring underfill underfilled such that all balls are
covered,
with or without an exterior fillet, no encroachment onto other
components and
only small voids, not touching any solder joints
* Component requiring underfill underfilled such that all balls are
covered,
with or without an exterior fillet, no encroachment onto other
components and
even large voiding, but not touching any solder joints
* A void or voids less than or equal to 50% around the perimeter of
one or
more solder joints
Defect - Class 1,2,3
* Underfill completely missing from components where it is required
* Underfill not completely covering all the peripheral solder joints
* Voiding such that a void traverses the distance between two or more
solder
joints under the array device requiring underfill
* A void or voids more than 50% around the perimeter of one or more
solder
joints
* Material extending on to the top of the BGA or CSP
* Uncured material
Special Conditions - Class 1,2
* Encroachment onto other components, but meeting all other criteria
above for
target or acceptab
le conditions will be dealt with as a pass/fail on a
case-by-case basis
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of bob wettermann
Sent: Thursday, June 04, 2009 4:42 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Dear Richard:
?
Pls send the proposal on to us. We perform underfill rework and this
issue
presents itslf fairly frequently.
?
Thanks
?
Bob Wettermann
[log in to unmask]
Bob Wettermann
PH 847-767-5745
--- On Thu, 6/4/09, Stadem, Richard D. <[log in to unmask]>
wrote:
From: Stadem, Richard D. <[log in to unmask]>
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
To: [log in to unmask]
Date: Thursday, June 4, 2009, 1:10 PM
I reviewed the proposed items for the standard and I think it looks
great. I have sent it to several other people directly involved in BGA,
CSP, and flipchip underfill at various companies in Minnesota for their
review and will pass on their comments as well.
Thank you for doing all of this work.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Thursday, June 04, 2009 11:43 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
The doc we are discussing is only for CSPs and BGAs. I did not want to
try and tackle too much, especially something that:
a) I don't know about
b) Has been around a lot longer and might already have a set of
pass/fail criteria
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, June 04, 2009 12:40 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Hi Graham - in the words of Sir Doug, "it depends"! Under most
situations,
that thin of underfill will have no influence on the solder joint
integrity. However, a specific component construction may not be happy
with any underfill on its top causing issues. The simple way to avoid
the
question is to not al
low underfill on the top of the BGA or CSP. I can't
speak for a flip chip as I don't have any underfill experience in that
realm.
Dave
Graham Collins <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/04/2009 11:20 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
[log in to unmask]
To
[log in to unmask]
cc
Subject
Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Absolutely.? If material interferes with installing heatsinks, it's
unacceptable.? But that would be true also of other methods like corner
bonding.
My question: would a thin film of underfill material, say a thou or two,
on a small section (say 15% of the top area) of a BGA have any impact to
reliability?? I am not talking about having big globs of the stuff on
top (although I still wonder how that would influence reliability).
In terms of impacting reliability, I think a more important criteria
would be that the underfill be even volume on each side (so the part
would be underfilled reasonably symmetrically).? Same size fillets on
opposing sides.
regards,
- Graham
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, June 04, 2009 1:12 PM
To: [log in to unmask]; Collins, Graham (FN) @ ESI
Subject: RE: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Too much material over the top of the component many add uncalculated
thickness when installing a heat sinks.
Vic,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Thursday, June 04, 2009 11:01 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
How?? And to what extent??? Would a tiny bit of underfill on one corner
hurt the reliability?? Are you talking about big lumps of underfill, or
a thin skin?
The underfill we use is pretty thin, runs everywhere if allowed to, and
will form a thin coating on top if it gets there.
regards,
- Graham
-----Original Message-----
From:
TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, June 04, 2009 12:41 PM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Yes, having some on top of the component hurts the reliability.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Thursday, June 04, 2009 10:27 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill Workmanship Pass/fail Criteria Proposal
Hi Bev
Why would material on the component top be considered a defect?? Process
indicator I can see, but does it impact reliability?
regards,
- Graham
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Thursday, June 04, 2009 12:07 PM
To: [log in to unmask]
Subject: [TN] Underfill Workmanship Pass/fail Criteria Proposal
TechNetters,
OK after speaking to a couple of industry friends, this is what we have
come up with. I will leave it to them to speak up and identify
themselves, if they wish.? I have written this up in IPC-A-610 format
and have tried to cover all situations for Class 2 and 3 products in
particular.
If we can nail this, I would like to present this to the IPC as the
first IPC draft doc essentially hammered out by out TechNet community.
Comments readily accepted!
Bev
RIM
Workmanship Standards for BGA and CSP Underfills
Target - Class 1,2,3
*? ? ? ? ? ? ? ? Component requiring underfill completely underfilled
with
a good
fillet all the way around, the fillet just approaching the maximum
component body height, completely cured, no encroachment onto other
components and no voiding whatsoever
Acceptable - Class 3
*? ? ? ? ? ? ? ? At least 50% fillet height up the side of the component
body
*? ? ? ? ? ? ? ? Small pin holes and voids are permissible provided they
do not
exceed 5% of fillet surface area and have a maximum diameter of 0.5 mm
(0.020 inches).
Acceptable - Class 1,2
*? ? ? ? ? ? ? ? Component requiring underfill underfilled such that all
balls
are covered, but no
evidence of an exterior fillet, no encroachment onto
other components and no voiding whatsoever
*? ? ? ? ? ? ? ? Component requiring underfill underfilled such that all
balls
are covered, with or without an exterior fillet, no encroachment onto
other components and only small voids, not touching any solder joints
*? ? ? ? ? ? ? ? Component requiring underfill underfilled such that all
balls
are covered, with or without an exterior fillet, no encroachment onto
other components and even large voiding, but not touching any solder
joints
*? ? ? ? ? ? ? ? A void or voids less than or equal to 50% around the
perimeter
of one or more solder joints
Defect - Class 1,2,3
*? ? ? ? ? ? ? ? Underfill completely missing from components where it
is
required
*? ? ? ? ? ? ? ? Underfill not completely covering all the peripheral
solder
joints
*? ? ? ? ? ? ? ? Voiding such that a void traverses the distance between
two or
more solder joints under the array device requiring underfill
*? ? ? ? ? ? ? ? A void or voids more than 50% around the perimeter of
one
or
more solder joints
*? ? ? ? ? ? ? ? Material extending on to the top of the BGA or CSP
*? ? ? ? ? ? ? ? Uncured material
Special Conditions - Class 1,2
*? ? ? ? ? ? ? ? Encroachment onto other components, but meeting all
other
criteria above for target or acceptable conditions will be dealt with as
a pass/fail on a case-by-case basis
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