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June 2009

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Subject:
From:
Blair Hogg <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Blair Hogg <[log in to unmask]>
Date:
Fri, 5 Jun 2009 13:39:00 -0500
Content-Type:
text/plain
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text/plain (56 lines)
Potting - The use of a material to isolate a device from its environment,
which may or may not completely surround the device, and which includes a
cavity which becomes part of the finished assembly. We do potting here, and
the box (plastic, metal) stays with the potted assembly. Not all of the unit
is potted, sometimes the potting covers components only and leaves terminal
blocks accessible.

Encapsulation - Probably a catch-all term, but suggests completely covering
the entire assembly, with only leads / wires emanating from the encapsulant.

Underfill is underfill - it is neither potting nor encapsulant. 

Blair

On Thu, 4 Jun 2009 13:32:28 -0500, Douglas Pauls
<[log in to unmask]> wrote:

>Good afternoon all,
>
>All this talk of underfill sparked a reminder of an IPC action item of
>mine.  Unknownst to most of you , I signed you all up on some of my
>committees.  There will be a new task group addressing potting and
>encapsulation, which will meet at the Fall IPC.  We already have conformal
>coat task groups.
>
>So, I wish to initiate a series of questions and illuminating debate.
>Pardon me if I fall short on the illumination part (leave it alone Dewey).
>
>1.  What would you consider to be a definition of "potting" and a
>definition of "encapsulation"?
>
>2.  Are there standard definitions for these somewhere?  They don't exist
>in IPC as far as I know.
>
>3.  What would you consider to be the boundary between conformal coating
>and "potting or encapsulation"?  I have my own opinions but want to hear
>yours.
>
>4.  In what class would you consider an underfill to be in?
>
>That's enough homework for now.
>
>Doug Pauls
>Rockwell Collins
>

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