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June 2009

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Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Fri, 5 Jun 2009 13:48:01 -0400
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text/plain (221 lines)
Good point Syed,

How about adding 'Molding' to differentiate from 'Potting' [and I just know
I will take heat for this] on the basis that when 'molded', the component
generally does not take the mold-form with itself in its finished state,
whereas if potted - the 'mold/pot' becomes part of the finished assembly.

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Syed Ahmad
Sent: Friday, June 05, 2009 11:27 AM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting

So the chip "encapsulation" to make a semiconductor package is actually
potting as the material is forced into a cavity around the chip?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, June 04, 2009 11:46 PM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting

Very good

So a definition might be:

Encapsulation: covering with a material which conforms to the general shape
of the surface being coated and the plane on which it is situated but such
material is not otherwise bounded in 2 or 3 dimensions.

Potting: covering with a material which completely covers the item being
treated; and which material takes the shape of and is bounded in 2 or 3
dimensions by the shape of the container in which the item being treated is
situated.



John Burke
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D. (Mark)
Sent: Thursday, June 04, 2009 4:31 PM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting

Can it be defined by geometry?
If you fill a box it's called potting, but if you coat an item is called
encapsulation?
mark


mark
Mark Woolley |PTRL Laboratory | Avaya | 1300 West 120th Ave |
Westminster, CO 80234  USA |email: [log in to unmask] |

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Thursday, June 04, 2009 1:04 PM
To: [log in to unmask]
Subject: Re: [TN] Coating, Encapsulation, and Potting

Interesting question Doug
 
1) My mental image is that it is that the term is related to processing

and potting is most often done atmospherically, with occasional vacuum
assist 
and encapsulation under pressure but it is pretty fungible with  lots of

fuzziness between the two. A potted assembly is definitely encapsulated
when 
finished. 
 
2) Likely? Yes but don't know where
 
3) Thickness of the coating seems reasonable but don't know where to
draw  
the line. 250 micron? 100? 500? Perhaps a percentage of total
thickness? 
5%? 10%?
 
4) In neither (or both depending on process). The other  two generally 
provide complete coverage of the device or assembly  underfill is by
definition 
partial.     
 
Joe   
 
 
In a message dated 6/4/2009 11:33:27 A.M. Pacific Daylight Time,  
[log in to unmask] writes:

Good  afternoon all,

All this talk of underfill sparked a reminder of an IPC  action item of 
mine.  Unknownst to most of you , I signed you all up  on some of my 
committees.  There will be a new task group addressing  potting and 
encapsulation, which will meet at the Fall IPC.  We  already have
conformal 
coat task groups. 

So, I wish to initiate a  series of questions and illuminating debate. 
Pardon me if I fall short on  the illumination part (leave it alone
Dewey).

1.  What would you  consider to be a definition of "potting" and a 
definition of  "encapsulation"? 

2.  Are there standard definitions for these  somewhere?  They don't
exist 
in IPC as far as I know.

3.   What would you consider to be the boundary between conformal
coating 
and  "potting or encapsulation"?  I have my own opinions but want to
hear  
yours.

4.  In what class would you consider an underfill to be  in?

That's enough homework for now. 

Doug Pauls
Rockwell  Collins

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