Nice

Karen Tellefsen - Electrical Testing
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             "Whittaker, Dewey                                             
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             "Whittaker, Dewey                                             
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ENCAPSULATION

Encapsulation is the encasement of a component in a resin coating by
dipping, spraying, or embedding with or without a mold. Encapsulants can be
designated as potting compounds, glob-topped or molding compounds.



POTTING

Potting involves surrounding the component housed in a container with a
liquid resin which is then cured in place. The container becomes an
integral part of the system such that the critical property that needs to
be maintained is the interfacial adhesion between the container and the
cured resin system for an optimum long-lasting reliable package.



CASTING OR EMBEDDING

Casting is similar to potting except (you don't inhale)¹ that the container
or mold is removed from the part after curing.



GLOB-TOPPED ENCAPSULATION

Glob-topped encapsulants consist of very viscous compounds that are usually
applied to a PB or other substrate.



MOLDING

Molding can be a general category of encapsulation. This is one of my areas
of expertise so I'll spare you the pressing details.



IMPREGNATION²

Impregnation is defined as process for the filling of voids and interstices
of a material with a liquid resin. Some of the types are as follows:

*            TRICKLE IMPREGNATION
*            VACUUM IMPREGNATION
*            VACUUM-PRESSURE IMPREGNATION
*            REINFORCEMENT IMPREGNATION



Note 1 - Establishing a precedent

Note 2 - Potential follow-up process to embedment



Dewey










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