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Date: | Thu, 4 Jun 2009 15:04:10 EDT |
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Interesting question Doug
1) My mental image is that it is that the term is related to processing
and potting is most often done atmospherically, with occasional vacuum assist
and encapsulation under pressure but it is pretty fungible with lots of
fuzziness between the two. A potted assembly is definitely encapsulated when
finished.
2) Likely? Yes but don't know where
3) Thickness of the coating seems reasonable but don't know where to draw
the line. 250 micron? 100? 500? Perhaps a percentage of total thickness?
5%? 10%?
4) In neither (or both depending on process). The other two generally
provide complete coverage of the device or assembly underfill is by definition
partial.
Joe
In a message dated 6/4/2009 11:33:27 A.M. Pacific Daylight Time,
[log in to unmask] writes:
Good afternoon all,
All this talk of underfill sparked a reminder of an IPC action item of
mine. Unknownst to most of you , I signed you all up on some of my
committees. There will be a new task group addressing potting and
encapsulation, which will meet at the Fall IPC. We already have conformal
coat task groups.
So, I wish to initiate a series of questions and illuminating debate.
Pardon me if I fall short on the illumination part (leave it alone Dewey).
1. What would you consider to be a definition of "potting" and a
definition of "encapsulation"?
2. Are there standard definitions for these somewhere? They don't exist
in IPC as far as I know.
3. What would you consider to be the boundary between conformal coating
and "potting or encapsulation"? I have my own opinions but want to hear
yours.
4. In what class would you consider an underfill to be in?
That's enough homework for now.
Doug Pauls
Rockwell Collins
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