For those of you who subscribe to the IPC DesignerCouncil email forum, this will be a duplicate topic...

We have a number of PCBAs with both leaded and lead-free parts on them.

Looking over the J-STD-020 reflow profiles on one of the leaded part datasheets, we saw that its range seemed too restrictive for the lead-free profile.

Basically the two parameters that interest us are:

(1) Preheat temperature, 100 oC-150 oC for leaded and 150 oC-200 oC for lead-free

(2) Liquidous temperature, 183 oC for leaded and 217 oC for lead-free.

On our assembly drawings we call out IPC-A-610 Class 2.  I understand that J-STD-002 can also be used together with IPC-A-610 as a note callout.

Since there is not a RoHS-compliant requirement for these boards, we don't call out what type of solder process needs to be used.

We're curious about how assembly shops adjust their soldering process for boards that have both types of parts on them.

We're also wondering whether we need to begin calling out specific solder processes, but we don't want to add cost to the assembly.

Give me a solution that doesn't add cost to the assembly, but at the same time satisfies the curious, please.

TIA and Best Regards,

Gary M. Koven, C.I.D.
Dynazign, Inc.
Charlotte, NC, USA
Veteran of the Marsh School

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